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39 Publications


2023 | Dissertation | LibreCat-ID: 41971
Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach
S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.
LibreCat | Files available | Download (ext.)
 

2023 | Conference Abstract | LibreCat-ID: 47234
Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells
B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), 2023.
LibreCat | Files available
 

2023 | Conference Abstract | LibreCat-ID: 47235
Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells
R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), 2023.
LibreCat | Files available
 

2023 | Conference Abstract | LibreCat-ID: 51117
Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.
LibreCat
 

2023 | Conference Abstract | LibreCat-ID: 51118
Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.
LibreCat
 

2023 | Conference Abstract | LibreCat-ID: 51119 LibreCat
 

2022 | Dissertation | LibreCat-ID: 34272 | OA
Enhanced process development by simulation of ultrasonic heavy wire bonding
R. Schemmel, Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding, Shaker, 2022.
LibreCat | Files available | DOI | Download (ext.)
 

2022 | Conference Paper | LibreCat-ID: 30371
Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding
O.E.C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, W. Sextro, in: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, Berlin, 2022, pp. 138–143.
LibreCat
 

2022 | Conference Paper | LibreCat-ID: 34104
Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding
C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022.
LibreCat | DOI
 

2022 | Report | LibreCat-ID: 52045
Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen
C. Scheidemann, T. Hemsel, W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen, LibreCat University, 2022.
LibreCat | Files available | DOI
 

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