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39 Publications
2023 | Dissertation | LibreCat-ID: 41971
Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach
S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.
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S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.
2023 | Conference Abstract | LibreCat-ID: 47234
Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells
B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), 2023.
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B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), 2023.
2023 | Conference Abstract | LibreCat-ID: 47235
Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells
R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), 2023.
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R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), 2023.
2023 | Conference Abstract | LibreCat-ID: 51117
Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.
LibreCat
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.
2023 | Conference Abstract | LibreCat-ID: 51118
Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.
LibreCat
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.
2023 | Conference Abstract | LibreCat-ID: 51119
Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process
C. Scheidemann, O.E.C. Hagedorn, T. Hemsel, W. Sextro, in: 2023.
LibreCat
C. Scheidemann, O.E.C. Hagedorn, T. Hemsel, W. Sextro, in: 2023.
2022 | Dissertation | LibreCat-ID: 34272 | 
Enhanced process development by simulation of ultrasonic heavy wire bonding
R. Schemmel, Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding, Shaker, 2022.
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R. Schemmel, Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding, Shaker, 2022.
2022 | Conference Paper | LibreCat-ID: 30371
Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding
O.E.C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, W. Sextro, in: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, Berlin, 2022, pp. 138–143.
LibreCat
O.E.C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, W. Sextro, in: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, Berlin, 2022, pp. 138–143.
2022 | Conference Paper | LibreCat-ID: 34104
Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding
C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022.
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C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022.
2022 | Report | LibreCat-ID: 52045
Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen
C. Scheidemann, T. Hemsel, W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen, LibreCat University, 2022.
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C. Scheidemann, T. Hemsel, W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen, LibreCat University, 2022.
2021 | Dissertation | LibreCat-ID: 34274
Prozessgerechte Gestaltung von Werkzeugen auf Basis von Verschleißsimulationen am Beispiel des Ultraschallbondens
P. Eichwald, Prozessgerechte Gestaltung von Werkzeugen auf Basis von Verschleißsimulationen am Beispiel des Ultraschallbondens, Shaker, 2021.
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P. Eichwald, Prozessgerechte Gestaltung von Werkzeugen auf Basis von Verschleißsimulationen am Beispiel des Ultraschallbondens, Shaker, 2021.
2021 | Conference Paper | LibreCat-ID: 25265
Application and modelling of ultrasonic transducers using 1-3 piezoelectric composites with structured electrodes
D. Dreiling, D. Itner, N. Feldmann, C. Scheidemann, H. Gravenkamp, B. Henning, in: Fortschritte Der Akustik - DAGA 2021, Deutsche Gesellschaft für Akustik e.V. (DEGA), Wien, 2021.
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D. Dreiling, D. Itner, N. Feldmann, C. Scheidemann, H. Gravenkamp, B. Henning, in: Fortschritte Der Akustik - DAGA 2021, Deutsche Gesellschaft für Akustik e.V. (DEGA), Wien, 2021.
2021 | Journal Article | LibreCat-ID: 21436
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.
LibreCat
| DOI
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.
2020 | Conference Paper | LibreCat-ID: 17355
Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding
R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro, in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
LibreCat
R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro, in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
2020 | Conference Paper | LibreCat-ID: 17706
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, in: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020.
LibreCat
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R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, in: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020.
2019 | Conference Paper | LibreCat-ID: 15244
Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen
O.E.C. Hagedorn, D. Pielsticker, T. Hemsel, W. Sextro, in: 2. VDI-Fachtagung Schwingungen 2019, VDI Verlag GmbH · Düsseldorf 2019, 2019.
LibreCat
O.E.C. Hagedorn, D. Pielsticker, T. Hemsel, W. Sextro, in: 2. VDI-Fachtagung Schwingungen 2019, VDI Verlag GmbH · Düsseldorf 2019, 2019.
2019 | Conference Paper | LibreCat-ID: 15412
Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding
R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann, W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 509–514.
LibreCat
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R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann, W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 509–514.
2019 | Journal Article | LibreCat-ID: 10334
Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.
LibreCat
| DOI
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.
2018 | Conference Paper | LibreCat-ID: 9992
Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process
C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
LibreCat
C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
2018 | Conference Paper | LibreCat-ID: 9993
Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
LibreCat
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.