Please note that LibreCat no longer supports Internet Explorer versions 8 or 9 (or earlier).

We recommend upgrading to the latest Internet Explorer, Google Chrome, or Firefox.

39 Publications


2018 | Conference Paper | LibreCat-ID: 9997
Effects of different working frequencies on the joint formation in copper wire bonding
R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, in: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.
LibreCat
 

2018 | Conference Paper | LibreCat-ID: 9998
Numerical and experimental investigations in ultrasonic heavy wire bonding
R. Schemmel, T. Hemsel, W. Sextro, in: 6th European Conference on Computational Mechanics (ECCM 6), Glasgow, UK, 2018, pp. 1–12.
LibreCat
 

2017 | Journal Article | LibreCat-ID: 9973
Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).
LibreCat
 

2017 | Dissertation | LibreCat-ID: 9986 | OA
Modellbasierte Mehrzieloptimierung zur Herstellung von Ultraschall-Drahtbondverbindungen in Leistungshalbleitermodulen
A. Unger, Modellbasierte Mehrzieloptimierung Zur Herstellung von Ultraschall-Drahtbondverbindungen in Leistungshalbleitermodulen, Universität Paderborn, 2017.
LibreCat | Download (ext.)
 

2016 | Conference Paper | LibreCat-ID: 9955
Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.
LibreCat | DOI
 

2016 | Journal Article | LibreCat-ID: 9957
Kupferbondverbindungen intelligent herstellen
M. Brökelmann, A. Unger, T. Meyer, S. Althoff, W. Sextro, M. Hunstig, F. Biermann, K. Guth, Wt-Online 7/8 (2016) 512–519.
LibreCat
 

2016 | Conference Paper | LibreCat-ID: 9959
Effect of different oxide layers on the ultrasonic copper wire bond process
F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.
LibreCat | DOI
 

2016 | Conference Paper | LibreCat-ID: 9960
Micro Wear Modeling in Copper Wire Wedge Bonding
P. Eichwald, A. Unger, F. Eacock, S. Althoff, W. Sextro, K. Guth, M. Brökelmann, in: IEEE CPMT Symposium Japan, 2016, 2016.
LibreCat
 

2016 | Conference Paper | LibreCat-ID: 9966
Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.
LibreCat | DOI
 

2016 | Conference Paper | LibreCat-ID: 9968
Validated Simulation of the Ultrasonic Wire Bonding Process
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.
LibreCat
 

2015 | Conference Paper | LibreCat-ID: 9943
Improving the cleaning process in copper wire bonding by adapting bonding parameters
S. Althoff, A. Unger, W. Sextro, F. Eacock, in: 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6.
LibreCat | DOI
 

2015 | Conference Paper | LibreCat-ID: 9951
Modeling and simulation of the ultrasonic wire bonding process
T. Meyer, A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: 2015 17th Electronics Packaging Technology Conference, 2015.
LibreCat | DOI
 

2015 | Conference Paper | LibreCat-ID: 9954
Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear
A. Unger, W. Sextro, T. Meyer, P. Eichwald, S. Althoff, F. Eacock, M. Brökelmann, in: 2015 17th Electronics Packaging Technology Conference, 2015.
LibreCat | DOI
 

2014 | Conference Paper | LibreCat-ID: 9868
Improving the bond quality of copper wire bonds using a friction model approach
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
LibreCat | DOI
 

2014 | Conference Paper | LibreCat-ID: 9870
Microstructural investigations of aluminum and copper wire bonds
F. Eacock , M. Schaper, S. Althoff, A. Unger, P. Eichwald, F. Hengsbach, C. Zinn, Martin Joachim Holzweissig, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014.
LibreCat | DOI
 

2014 | Conference Paper | LibreCat-ID: 9895
Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.
LibreCat
 

2014 | Conference Paper | LibreCat-ID: 9896
Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding
A. Unger, W. Sextro, S. Althoff, T. Meyer, M. Brökelmann, K. Neumann, R.F. Reimann, K. Guth, D. Bolowski, in: Proceedings of 8th International Conference on Integrated Power Electronic Systems, 2014, pp. 175–180.
LibreCat
 

2013 | Conference Paper | LibreCat-ID: 9797
A friction based approach for modeling wire bonding
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International Symposium on Microelectronics, Orlando (Florida), USA, 2013.
LibreCat | DOI
 

2013 | Conference Paper | LibreCat-ID: 9799
Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding
P. Eichwald, W. Sextro, S. Althoff, F. Eacock, M. Schnietz, K. Guth, M. Brökelmann, in: 15th Electronics Packaging Technology Conference, 2013.
LibreCat | DOI
 

Filters and Search Terms

38259 OR 53321 OR althoff OR 21436 OR 17355 OR 17706 OR 15412 OR 10334 OR 9992 OR 9993 OR 9997 OR 9998 OR 9973 OR 9968 OR 9986 OR 34272 OR 34274

department=151

Search

Filter Publications

Display / Sort

Export / Embed