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39 Publications
2018 | Conference Paper | LibreCat-ID: 9997
Schemmel, Reinhard, et al. “Effects of Different Working Frequencies on the Joint Formation in Copper Wire Bonding.” CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), 2018, pp. 230–35.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9998
Schemmel, Reinhard, et al. “Numerical and Experimental Investigations in Ultrasonic Heavy Wire Bonding.” 6th European Conference on Computational Mechanics (ECCM 6), 2018, pp. 1–12.
LibreCat
2017 | Journal Article | LibreCat-ID: 9973
Eichwald, Paul, et al. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design.” IMAPSource, vol. Vol. 2017, No. 1, 2017.
LibreCat
2017 | Dissertation | LibreCat-ID: 9986 | 
Unger, Andreas. Modellbasierte Mehrzieloptimierung Zur Herstellung von Ultraschall-Drahtbondverbindungen in Leistungshalbleitermodulen. Universität Paderborn, 2017.
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2016 | Conference Paper | LibreCat-ID: 9955
Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–10, doi:10.1109/ECTC.2016.234.
LibreCat
| DOI
2016 | Journal Article | LibreCat-ID: 9957
Brökelmann, Michael, et al. “Kupferbondverbindungen Intelligent Herstellen.” Wt-Online, vol. 7/8, 2016, pp. 512–19.
LibreCat
2016 | Conference Paper | LibreCat-ID: 9959
Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–18, doi:10.1109/ECTC.2016.91.
LibreCat
| DOI
2016 | Conference Paper | LibreCat-ID: 9960
Eichwald, Paul, et al. “Micro Wear Modeling in Copper Wire Wedge Bonding.” IEEE CPMT Symposium Japan, 2016, 2016.
LibreCat
2016 | Conference Paper | LibreCat-ID: 9966
Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–28, doi:10.1109/ECTC.2016.215.
LibreCat
| DOI
2016 | Conference Paper | LibreCat-ID: 9968
Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–54.
LibreCat
2015 | Conference Paper | LibreCat-ID: 9943
Althoff, Simon, et al. “Improving the Cleaning Process in Copper Wire Bonding by Adapting Bonding Parameters.” 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6, doi:10.1109/EPTC.2015.7412402.
LibreCat
| DOI
2015 | Conference Paper | LibreCat-ID: 9951
Meyer, Tobias, et al. “Modeling and Simulation of the Ultrasonic Wire Bonding Process.” 2015 17th Electronics Packaging Technology Conference, 2015, doi:10.1109/EPTC.2015.7412377.
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| DOI
2015 | Conference Paper | LibreCat-ID: 9954
Unger, Andreas, et al. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” 2015 17th Electronics Packaging Technology Conference, 2015, doi:10.1109/EPTC.2015.7412375.
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9868
Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–55, doi:10.1109/ECTC.2014.6897500.
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9870
Eacock , Florian, et al. “Microstructural Investigations of Aluminum and Copper Wire Bonds.” Proceedings of the 47th International Symposium on Microelectronics, 2014, doi:10.4071/isom-THP32.
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9895
Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–94.
LibreCat
2014 | Conference Paper | LibreCat-ID: 9896
Unger, Andreas, et al. “Data-Driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding.” Proceedings of 8th International Conference on Integrated Power Electronic Systems, vol. 141, 2014, pp. 175–80.
LibreCat
2013 | Conference Paper | LibreCat-ID: 9797
Althoff, Simon, et al. “A Friction Based Approach for Modeling Wire Bonding.” IMAPS 2013, 46th International Symposium on Microelectronics, 2013, doi:10.4071/isom-2013-TA67.
LibreCat
| DOI
2013 | Conference Paper | LibreCat-ID: 9799
Eichwald, Paul, et al. “Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding.” 15th Electronics Packaging Technology Conference, 2013, doi:10.1109/EPTC.2013.6745803.
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| DOI