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302 Publications


2019 | Conference Paper | LibreCat-ID: 15412
Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding
R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann, W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 509–514.
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2019 | Journal Article | LibreCat-ID: 10334
Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.
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2019 | Conference Paper | LibreCat-ID: 13460 | OA
Remaining useful lifetime prediction based on adaptive failure thresholds
A. Bender, L. Schinke, W. Sextro, in: M. Beer, E. Zio (Eds.), Proceedings of the 29th European Safety and Reliability Conference (ESREL2019), 2019, pp. 1262–1269.
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2019 | Conference Paper | LibreCat-ID: 13461 | OA
Digital Twin for Reliability Analysis During Design and Operation of Mechatronic Systems
T. Kaul, A. Bender, W. Sextro, in: M. Beer, E. Zio (Eds.), Proceedings of the 29th European Safety and Reliability Conference (ESREL2019), 2019, pp. 2340–2347.
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2018 | Conference Paper | LibreCat-ID: 9987
A particle filtering approach for temperature based prognostics
A. Bender, W. Sextro, in: Safety and Reliability – Safe Societies in a Changing World, Trondheim, Norway, 2018, pp. 1025–1033.
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2018 | Journal Article | LibreCat-ID: 9990
Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders
P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, W. Sextro, ACTUATOR 2018; 16th International Conference on New Actuators (2018) 142–145.
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2018 | Journal Article | LibreCat-ID: 9991
Vibration-Assisted Handling of Dry Fine Powders
P. Dunst, P. Bornmann, T. Hemsel, W. Sextro, Actuators 2018, 7(2). (2018) 1–11.
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2018 | Conference Paper | LibreCat-ID: 9992
Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process
C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
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2018 | Conference Paper | LibreCat-ID: 9993
Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
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2018 | Book | LibreCat-ID: 9995
Steigerung der Intelligenz mechatronischer Systeme
T. Meyer, T. Kaul, J.K. Kimotho, W. Sextro, Steigerung Der Intelligenz Mechatronischer Systeme, Springer Nature Switzerland AG. Part of Springer Nature., 2018.
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