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3 Publications
2021 | Journal Article | LibreCat-ID: 21436
Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability. 2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077
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| DOI
2019 | Journal Article | LibreCat-ID: 3585
Witschen LM, Wiersema T, Ghasemzadeh Mohammadi H, Awais M, Platzner M. CIRCA: Towards a Modular and Extensible Framework for Approximate Circuit Generation. Microelectronics Reliability. 2019;99:277-290. doi:10.1016/j.microrel.2019.04.003
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| DOI
2014 | Journal Article | LibreCat-ID: 39483
Vidor FF, Wirth GI, Hilleringmann U. Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics. Microelectronics Reliability. 2014;54(12):2760-2765. doi:10.1016/j.microrel.2014.07.147
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| DOI