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3 Publications
2021 | Journal Article | LibreCat-ID: 21436
Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability, 119, 114077. https://doi.org/10.1016/j.microrel.2021.114077
LibreCat
| DOI
2019 | Journal Article | LibreCat-ID: 3585
Witschen, L. M., Wiersema, T., Ghasemzadeh Mohammadi, H., Awais, M., & Platzner, M. (2019). CIRCA: Towards a Modular and Extensible Framework for Approximate Circuit Generation. Microelectronics Reliability, 99, 277–290. https://doi.org/10.1016/j.microrel.2019.04.003
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| DOI
2014 | Journal Article | LibreCat-ID: 39483
Vidor, F. F., Wirth, G. I., & Hilleringmann, U. (2014). Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics. Microelectronics Reliability, 54(12), 2760–2765. https://doi.org/10.1016/j.microrel.2014.07.147
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| DOI