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3 Publications
2021 | Journal Article | LibreCat-ID: 21436
Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability, vol. 119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.
LibreCat
| DOI
2019 | Journal Article | LibreCat-ID: 3585
Witschen, Linus Matthias, et al. “CIRCA: Towards a Modular and Extensible Framework for Approximate Circuit Generation.” Microelectronics Reliability, vol. 99, Elsevier, 2019, pp. 277–90, doi:10.1016/j.microrel.2019.04.003.
LibreCat
| DOI
2014 | Journal Article | LibreCat-ID: 39483
Vidor, F. F., et al. “Low Temperature Fabrication of a ZnO Nanoparticle Thin-Film Transistor Suitable for Flexible Electronics.” Microelectronics Reliability, vol. 54, no. 12, Elsevier BV, 2014, pp. 2760–65, doi:10.1016/j.microrel.2014.07.147.
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| DOI