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3 Publications
2021 | Journal Article | LibreCat-ID: 21436
R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.
LibreCat
| DOI
2014 | Journal Article | LibreCat-ID: 39483
F. F. Vidor, G. I. Wirth, and U. Hilleringmann, “Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics,” Microelectronics Reliability, vol. 54, no. 12, pp. 2760–2765, 2014, doi: 10.1016/j.microrel.2014.07.147.
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| DOI