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23 Publications
2014 | Conference Paper | LibreCat-ID: 9871
Eichwald P, Sextro W, Althof S, et al. Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In: Proceedings of the 47th International Symposium on Microelectronics. ; 2014:856-861. doi:10.4071/isom-THP34
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9895
Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: Proceedings of the 47th International Symposium on Microelectronics (IMAPS). San Diego, CA, US; 2014:289-294.
LibreCat
2010 | Journal Article | LibreCat-ID: 4548
Herres-Pawlis S, Berth G, Wiedemeier V, Schmidt L, Zrenner A, Warnecke H-J. Oxygen sensing by fluorescence quenching of [Cu(btmgp)I]. Journal of Luminescence. 2010;130(10):1958-1962. doi:10.1016/j.jlumin.2010.05.012
LibreCat
| DOI