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23 Publications
2014 | Conference Paper | LibreCat-ID: 9871
Eichwald, Paul, et al. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–61, doi:10.4071/isom-THP34.
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9895
Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–94.
LibreCat
2010 | Journal Article | LibreCat-ID: 4548
Herres-Pawlis, Sonja, et al. “Oxygen Sensing by Fluorescence Quenching of [Cu(Btmgp)I].” Journal of Luminescence, vol. 130, no. 10, Elsevier BV, 2010, pp. 1958–62, doi:10.1016/j.jlumin.2010.05.012.
LibreCat
| DOI