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17 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol. 15. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2023.
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2023 | Conference Paper | LibreCat-ID: 44036
Borgert, Thomas, and Werner Homberg. “Analysis of Temperature Effect on Strength and Microstructure in Friction Induced Recycling Process (FIRP).” In Materials Research Proceedings. Materials Research Forum LLC, 2023. https://doi.org/10.21741/9781644902479-211.
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2023 | Conference Paper | LibreCat-ID: 43044
Holzmüller, Maik, Maik Linnemann, Werner Homberg, Verena Psyk, Verena Kräusel, and Janika Kroos. “Proof of Concept for Incremental Sheet Metal Forming by Means of Electromagnetic and Electrohydraulic High-Speed Forming.” In Materials Research Proceedings, 25:11–18. Materials Research Forum LLC, 2023. https://doi.org/10.21741/9781644902417-2.
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2021 | Journal Article | LibreCat-ID: 24589
Zhuravlev, Evgeny, Benjamin Milkereit, Bin Yang, Steffen Heiland, Pascal Vieth, Markus Voigt, Mirko Schaper, Guido Grundmeier, Christoph Schick, and Olaf Kessler. “Assessment of AlZnMgCu Alloy Powder Modification for Crack-Free Laser Powder Bed Fusion by Differential Fast Scanning Calorimetry.” Materials & Design, 2021. https://doi.org/10.1016/j.matdes.2021.109677.
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2021 | Dissertation | LibreCat-ID: 37579
Camberg, Alan Adam. Festigkeitssteigerung von Aluminiumblechformteilen der 5000-Serie durch Erweiterung der Formgebungsgrenzen stark kaltverfestigter Ausgangswerkstoffe. Vol. 2021,52. Schriftenreihe Institut für Leichtbau mit Hybridsystemen. Shaker Verlag, 2021. https://doi.org/10.2370/9783844082715.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability 119 (2021): 114077. https://doi.org/10.1016/j.microrel.2021.114077.
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2020 | Journal Article | LibreCat-ID: 19973
Uhe, Benedikt, Clara-Maria Kuball, Marion Merklein, and Gerson Meschut. “Improvement of a Rivet Geometry for the Self-Piercing Riveting of High-Strength Steel and Multi-Material Joints.” Production Engineering 14 (2020): 417–23. https://doi.org/10.1007/s11740-020-00973-w.
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2018 | Conference Paper | LibreCat-ID: 9999
Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, Vol. Vol. 2018, No. 1, pp. 000572-000577., 2018. https://doi.org/10.4071/2380-4505-2018.1.000572.
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2018 | Journal Article | LibreCat-ID: 13186
Rösener, Thomas, Alexander Hoffmann, and Sonja Herres-Pawlis. “Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility.” European Journal of Inorganic Chemistry 2018, no. 27 (2018): 3164–75. https://doi.org/10.1002/ejic.201800511.
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2017 | Journal Article | LibreCat-ID: 13187
Oppermann, Alexander, Larissa Laurini, Fabian Etscheidt, Katharina Hollmann, Florian Strassl, Alexander Hoffmann, Daniela Schurr, Roland Dittmeyer, Günter Rinke, and Sonja Herres-Pawlis. “Detection of Copper Bisguanidine NO Adducts by UV-Vis Spectroscopy and a SuperFocus Mixer.” Chemical Engineering \& Technology 40, no. 8 (2017): 1475–83. https://doi.org/10.1002/ceat.201600691.
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2016 | Conference Paper | LibreCat-ID: 9959
Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” In IEEE 66th Electronic Components and Technology Conference, 2111–18, 2016. https://doi.org/10.1109/ECTC.2016.91.
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2016 | Conference Paper | LibreCat-ID: 9966
Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” In IEEE 66th Electronic Components and Technology Conference, 622–28, 2016. https://doi.org/10.1109/ECTC.2016.215.
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2014 | Conference Paper | LibreCat-ID: 9868
Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 1549–55, 2014. https://doi.org/10.1109/ECTC.2014.6897500.
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2014 | Conference Paper | LibreCat-ID: 9870
Eacock , Florian, Mirko Schaper, Simon Althoff, Andreas Unger, Paul Eichwald, Florian Hengsbach, Carolin Zinn, Martin Joachim Holzweissig, and Karsten Guth. “Microstructural Investigations of Aluminum and Copper Wire Bonds.” In Proceedings of the 47th International Symposium on Microelectronics, 2014. https://doi.org/10.4071/isom-THP32.
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2014 | Conference Paper | LibreCat-ID: 9871
Eichwald, Paul, Walter Sextro, Simon Althof, Florian Eacock, Andreas Unger, Tobias Meyer, and Karsten Guth. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” In Proceedings of the 47th International Symposium on Microelectronics, 856–61, 2014. https://doi.org/10.4071/isom-THP34.
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2014 | Conference Paper | LibreCat-ID: 9895
Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer, Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 289–94. San Diego, CA, US, 2014.
LibreCat
2010 | Journal Article | LibreCat-ID: 4548
Herres-Pawlis, Sonja, Gerhard Berth, Volker Wiedemeier, Ludger Schmidt, Artur Zrenner, and Hans-Joachim Warnecke. “Oxygen Sensing by Fluorescence Quenching of [Cu(Btmgp)I].” Journal of Luminescence 130, no. 10 (2010): 1958–62. https://doi.org/10.1016/j.jlumin.2010.05.012.
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