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17 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff, S. (2023). Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach (Vol. 15). Shaker.
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2023 | Conference Paper | LibreCat-ID: 44036
Borgert, T., & Homberg, W. (2023). Analysis of temperature effect on strength and microstructure in friction induced recycling process (FIRP). Materials Research Proceedings. ESAFORM 2023, Kraków. https://doi.org/10.21741/9781644902479-211
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2023 | Conference Paper | LibreCat-ID: 43044
Holzmüller, M., Linnemann, M., Homberg, W., Psyk, V., Kräusel, V., & Kroos, J. (2023). Proof of concept for incremental sheet metal forming by means of electromagnetic and electrohydraulic high-speed forming. Materials Research Proceedings, 25, 11–18. https://doi.org/10.21741/9781644902417-2
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2021 | Journal Article | LibreCat-ID: 24589
Zhuravlev, E., Milkereit, B., Yang, B., Heiland, S., Vieth, P., Voigt, M., Schaper, M., Grundmeier, G., Schick, C., & Kessler, O. (2021). Assessment of AlZnMgCu alloy powder modification for crack-free laser powder bed fusion by differential fast scanning calorimetry. Materials & Design, Article 109677. https://doi.org/10.1016/j.matdes.2021.109677
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2021 | Dissertation | LibreCat-ID: 37579
Camberg, A. A. (2021). Festigkeitssteigerung von Aluminiumblechformteilen der 5000-Serie durch Erweiterung der Formgebungsgrenzen stark kaltverfestigter Ausgangswerkstoffe: Vol. 2021,52. Shaker Verlag. https://doi.org/10.2370/9783844082715
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability, 119, 114077. https://doi.org/10.1016/j.microrel.2021.114077
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2020 | Journal Article | LibreCat-ID: 19973
Uhe, B., Kuball, C.-M., Merklein, M., & Meschut, G. (2020). Improvement of a rivet geometry for the self-piercing riveting of high-strength steel and multi-material joints. Production Engineering, 14, 417–423. https://doi.org/10.1007/s11740-020-00973-w
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2018 | Conference Paper | LibreCat-ID: 9999
Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., & Sextro, W. (2018). Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018 (Vol. Vol. 2018, No. 1, pp. 000572-000577.). https://doi.org/10.4071/2380-4505-2018.1.000572
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2018 | Journal Article | LibreCat-ID: 13186
Rösener, T., Hoffmann, A., & Herres-Pawlis, S. (2018). Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility. European Journal of Inorganic Chemistry, 2018(27), 3164–3175. https://doi.org/10.1002/ejic.201800511
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2017 | Journal Article | LibreCat-ID: 13187
Oppermann, A., Laurini, L., Etscheidt, F., Hollmann, K., Strassl, F., Hoffmann, A., … Herres-Pawlis, S. (2017). Detection of Copper Bisguanidine NO Adducts by UV-vis Spectroscopy and a SuperFocus Mixer. Chemical Engineering \& Technology, 40(8), 1475–1483. https://doi.org/10.1002/ceat.201600691
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2016 | Conference Paper | LibreCat-ID: 9959
Eacock, F., Unger, A., Eichwald, P., Grydin, O., Hengsbach, F., Althoff, S., … Guth, K. (2016). Effect of different oxide layers on the ultrasonic copper wire bond process. In IEEE 66th Electronic Components and Technology Conference (pp. 2111–2118). https://doi.org/10.1109/ECTC.2016.91
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2016 | Conference Paper | LibreCat-ID: 9966
Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M., & Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In IEEE 66th Electronic Components and Technology Conference (pp. 622–628). https://doi.org/10.1109/ECTC.2016.215
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2014 | Conference Paper | LibreCat-ID: 9868
Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555). https://doi.org/10.1109/ECTC.2014.6897500
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2014 | Conference Paper | LibreCat-ID: 9870
Eacock , F., Schaper, M., Althoff, S., Unger, A., Eichwald, P., Hengsbach, F., … Guth, K. (2014). Microstructural investigations of aluminum and copper wire bonds. In Proceedings of the 47th International Symposium on Microelectronics. https://doi.org/10.4071/isom-THP32
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2014 | Conference Paper | LibreCat-ID: 9871
Eichwald, P., Sextro, W., Althof, S., Eacock, F., Unger, A., Meyer, T., & Guth, K. (2014). Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In Proceedings of the 47th International Symposium on Microelectronics (pp. 856–861). https://doi.org/10.4071/isom-THP34
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2014 | Conference Paper | LibreCat-ID: 9895
Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., & Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In Proceedings of the 47th International Symposium on Microelectronics (IMAPS) (pp. 289–294). San Diego, CA, US.
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2010 | Journal Article | LibreCat-ID: 4548
Herres-Pawlis, S., Berth, G., Wiedemeier, V., Schmidt, L., Zrenner, A., & Warnecke, H.-J. (2010). Oxygen sensing by fluorescence quenching of [Cu(btmgp)I]. Journal of Luminescence, 130(10), 1958–1962. https://doi.org/10.1016/j.jlumin.2010.05.012
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