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17 Publications


2023 | Dissertation | LibreCat-ID: 41971
S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach, vol. 15. Shaker, 2023.
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2023 | Conference Paper | LibreCat-ID: 44036
T. Borgert and W. Homberg, “Analysis of temperature effect on strength and microstructure in friction induced recycling process (FIRP),” presented at the ESAFORM 2023, Kraków, 2023, doi: 10.21741/9781644902479-211.
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2023 | Conference Paper | LibreCat-ID: 43044
M. Holzmüller, M. Linnemann, W. Homberg, V. Psyk, V. Kräusel, and J. Kroos, “Proof of concept for incremental sheet metal forming by means of electromagnetic and electrohydraulic high-speed forming,” in Materials Research Proceedings, Nürnberg, 2023, vol. 25, pp. 11–18, doi: 10.21741/9781644902417-2.
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2021 | Journal Article | LibreCat-ID: 24589
E. Zhuravlev et al., “Assessment of AlZnMgCu alloy powder modification for crack-free laser powder bed fusion by differential fast scanning calorimetry,” Materials & Design, Art. no. 109677, 2021, doi: 10.1016/j.matdes.2021.109677.
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2021 | Dissertation | LibreCat-ID: 37579
A. A. Camberg, Festigkeitssteigerung von Aluminiumblechformteilen der 5000-Serie durch Erweiterung der Formgebungsgrenzen stark kaltverfestigter Ausgangswerkstoffe, vol. 2021,52. Shaker Verlag, 2021.
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2021 | Journal Article | LibreCat-ID: 21436
R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.
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2020 | Journal Article | LibreCat-ID: 19973
B. Uhe, C.-M. Kuball, M. Merklein, and G. Meschut, “Improvement of a rivet geometry for the self-piercing riveting of high-strength steel and multi-material joints,” Production Engineering, vol. 14, pp. 417–423, 2020, doi: 10.1007/s11740-020-00973-w.
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2018 | Conference Paper | LibreCat-ID: 9999
A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges,” in In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.
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2018 | Journal Article | LibreCat-ID: 13186
T. Rösener, A. Hoffmann, and S. Herres-Pawlis, “Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility,” European Journal of Inorganic Chemistry, vol. 2018, no. 27, pp. 3164–3175, 2018.
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2017 | Journal Article | LibreCat-ID: 13187
A. Oppermann et al., “Detection of Copper Bisguanidine NO Adducts by UV-vis Spectroscopy and a SuperFocus Mixer,” Chemical Engineering \& Technology, vol. 40, no. 8, pp. 1475–1483, 2017.
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2016 | Conference Paper | LibreCat-ID: 9959
F. Eacock et al., “Effect of different oxide layers on the ultrasonic copper wire bond process,” in IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.
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2016 | Conference Paper | LibreCat-ID: 9966
T. Meyer et al., “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation,” in IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.
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2014 | Conference Paper | LibreCat-ID: 9868
S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality of copper wire bonds using a friction model approach,” in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
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2014 | Conference Paper | LibreCat-ID: 9870
F. Eacock et al., “Microstructural investigations of aluminum and copper wire bonds,” in Proceedings of the 47th International Symposium on Microelectronics, 2014.
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2014 | Conference Paper | LibreCat-ID: 9871
P. Eichwald et al., “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
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2014 | Conference Paper | LibreCat-ID: 9895
A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–294.
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2010 | Journal Article | LibreCat-ID: 4548
S. Herres-Pawlis, G. Berth, V. Wiedemeier, L. Schmidt, A. Zrenner, and H.-J. Warnecke, “Oxygen sensing by fluorescence quenching of [Cu(btmgp)I],” Journal of Luminescence, vol. 130, no. 10, pp. 1958–1962, 2010.
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