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19 Publications
2025 | Journal Article | LibreCat-ID: 58163 | 
S. Wu et al., “Correlation between interlaminar shear strength of CFRP and joint strength of aluminium-CFRP hybrid joints,” The Journal of Adhesion, pp. 1–26, 2025, doi: 10.1080/00218464.2024.2439956.
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2025 | Journal Article | LibreCat-ID: 58807
M. Neuser et al., “Mechanical properties and joinability of the near-eutectic aluminium casting alloy AlSi12,” The Journal of Materials: Design and Applications, Part L, 2025, doi: 10.1177/14644207251319922.
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2023 | Dissertation | LibreCat-ID: 41971
S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach, vol. 15. Shaker, 2023.
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2023 | Conference Paper | LibreCat-ID: 44036
T. Borgert and W. Homberg, “Analysis of temperature effect on strength and microstructure in friction induced recycling process (FIRP),” presented at the ESAFORM 2023, Kraków, 2023, doi: 10.21741/9781644902479-211.
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2023 | Conference Paper | LibreCat-ID: 43044
M. Holzmüller, M. Linnemann, W. Homberg, V. Psyk, V. Kräusel, and J. Kroos, “Proof of concept for incremental sheet metal forming by means of electromagnetic and electrohydraulic high-speed forming,” in Materials Research Proceedings, Nürnberg, 2023, vol. 25, pp. 11–18, doi: 10.21741/9781644902417-2.
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2021 | Journal Article | LibreCat-ID: 24589
E. Zhuravlev et al., “Assessment of AlZnMgCu alloy powder modification for crack-free laser powder bed fusion by differential fast scanning calorimetry,” Materials & Design, Art. no. 109677, 2021, doi: 10.1016/j.matdes.2021.109677.
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2021 | Journal Article | LibreCat-ID: 21436
R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.
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2020 | Journal Article | LibreCat-ID: 19973
B. Uhe, C.-M. Kuball, M. Merklein, and G. Meschut, “Improvement of a rivet geometry for the self-piercing riveting of high-strength steel and multi-material joints,” Production Engineering, vol. 14, pp. 417–423, 2020, doi: 10.1007/s11740-020-00973-w.
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2018 | Conference Paper | LibreCat-ID: 9999
A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges,” in In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.
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2018 | Journal Article | LibreCat-ID: 13186
T. Rösener, A. Hoffmann, and S. Herres-Pawlis, “Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility,” European Journal of Inorganic Chemistry, vol. 2018, no. 27, pp. 3164–3175, 2018.
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2014 | Conference Paper | LibreCat-ID: 9895
A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–294.
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