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29 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff S. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol 15. Shaker; 2023.
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2023 | Journal Article | LibreCat-ID: 43371
Voswinkel D. Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties. Journal of Manufacturing Processes. 2023;94:10-19. doi:/10.1016/j.jmapro.2023.03.056
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2023 | Journal Article | LibreCat-ID: 43437 | 
Klowait N. On the Multimodal Resolution of a Search Sequence in Virtual Reality. Human Behavior and Emerging Technologies. 2023;2023:1-15. doi:10.1155/2023/8417012
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2022 | Journal Article | LibreCat-ID: 33988
Moritzer E, Driediger C. Reactive Direct Bonding of Digital Light Process Components. Macromolecular Symposia. 2022;404(1). doi:10.1002/masy.202100396
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2022 | Conference Paper | LibreCat-ID: 29803
Hesse M, Hunstig M, Timmermann J, Trächtler A. Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design. In: Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM). ; 2022:383-394.
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2022 | Conference Paper | LibreCat-ID: 48894
Nikfarjam A, Neumann A, Bossek J, Neumann F. Co-Evolutionary Diversity Optimisation for the Traveling Thief Problem. In: Rudolph G, Kononova AV, Aguirre H, Kerschke P, Ochoa G, Tu\v sar T, eds. Parallel Problem Solving from Nature (PPSN XVII). Lecture Notes in Computer Science. Springer International Publishing; 2022:237–249. doi:10.1007/978-3-031-14714-2_17
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability. 2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077
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2019 | Dissertation | LibreCat-ID: 41958
Opdemom H. Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen. Vol 2019,35. Shaker Verlag; 2019.
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2019 | Journal Article | LibreCat-ID: 10334
Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical. 2019;295:653-662. doi:10.1016/j.sna.2019.04.025
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2018 | Conference Paper | LibreCat-ID: 9992
Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany). ; 2018:1-6.
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2018 | Conference Paper | LibreCat-ID: 9993
Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan). ; 2018:41-44.
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2018 | Conference Paper | LibreCat-ID: 9999
Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:10.4071/2380-4505-2018.1.000572
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2018 | Journal Article | LibreCat-ID: 30935
Anderski J, Mahlert L, Sun J, et al. Light-responsive nanoparticles based on new polycarbonate polymers as innovative drug delivery systems for photosensitizers in PDT. International Journal of Pharmaceutics. 2018;557:182-191. doi:10.1016/j.ijpharm.2018.12.040
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2017 | Conference Paper | LibreCat-ID: 9982
Schemmel R, Hemsel T, Sextro W. MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In: 43. Deutsche Jahrestagung Für Akustik. Kiel 2017; 2017:611-614.
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2017 | Journal Article | LibreCat-ID: 13238
Lücke A, Gerstmann U, Kühne TD, Schmidt WG. Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition. Journal of Computational Chemistry. 2017;38(26):2276-2282. doi:10.1002/jcc.24878
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2016 | Conference Paper | LibreCat-ID: 9955
Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In: IEEE 66th Electronic Components and Technology Conference. ; 2016:2103-2110. doi:10.1109/ECTC.2016.234
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2016 | Conference Paper | LibreCat-ID: 9959
Eacock F, Unger A, Eichwald P, et al. Effect of different oxide layers on the ultrasonic copper wire bond process. In: IEEE 66th Electronic Components and Technology Conference. ; 2016:2111-2118. doi:10.1109/ECTC.2016.91
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2016 | Conference Paper | LibreCat-ID: 9968
Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.
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2014 | Conference Paper | LibreCat-ID: 9868
Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper wire bonds using a friction model approach. In: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. ; 2014:1549-1555. doi:10.1109/ECTC.2014.6897500
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2014 | Conference Paper | LibreCat-ID: 9870
Eacock F, Schaper M, Althoff S, et al. Microstructural investigations of aluminum and copper wire bonds. In: Proceedings of the 47th International Symposium on Microelectronics. ; 2014. doi:10.4071/isom-THP32
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