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30 Publications
2023 | Journal Article | LibreCat-ID: 43437 | 
Klowait, Nils. “On the Multimodal Resolution of a Search Sequence in Virtual Reality.” Human Behavior and Emerging Technologies, vol. 2023, Hindawi Limited, 2023, pp. 1–15, doi:10.1155/2023/8417012.
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2023 | Dissertation | LibreCat-ID: 41971
Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Shaker, 2023.
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2023 | Journal Article | LibreCat-ID: 43371
Voswinkel, Dietrich. “Application of a New Strategy for Time-Efficient Laser Treatment of Galvanized Steel Substrates to Improve the Adhesion Properties.” Journal of Manufacturing Processes, vol. 94, Elsevier, 2023, pp. 10–19, doi:/10.1016/j.jmapro.2023.03.056.
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2022 | Journal Article | LibreCat-ID: 33988
Moritzer, Elmar, and Christine Driediger. “Reactive Direct Bonding of Digital Light Process Components.” Macromolecular Symposia, vol. 404, no. 1, 2100396, Wiley, 2022, doi:10.1002/masy.202100396.
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2022 | Conference Paper | LibreCat-ID: 48894
Nikfarjam, Adel, et al. “Co-Evolutionary Diversity Optimisation for the Traveling Thief Problem.” Parallel Problem Solving from Nature (PPSN XVII), edited by Günter Rudolph et al., Springer International Publishing, 2022, pp. 237–249, doi:10.1007/978-3-031-14714-2_17.
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2022 | Conference Paper | LibreCat-ID: 29803
Hesse, Michael, et al. “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-Forward Control Design.” Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 2022, pp. 383–94.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability, vol. 119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.
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2019 | Dissertation | LibreCat-ID: 41958
Opdemom, Hermann. Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen. Shaker Verlag, 2019.
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2019 | Journal Article | LibreCat-ID: 10334
Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical, vol. 295, 2019, pp. 653–62, doi:10.1016/j.sna.2019.04.025.
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2019 | Journal Article | LibreCat-ID: 64018
Neumann, Sarah, et al. “Insights into the Reaction Mechanism and Particle Size Effects of CO Oxidation over Supported Pt Nanoparticle Catalysts.” Journal of Catalysis, vol. 377, 2019, pp. 662–672, doi:10.1016/j.jcat.2019.07.049.
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2018 | Conference Paper | LibreCat-ID: 9992
Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
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2018 | Conference Paper | LibreCat-ID: 9993
Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
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2018 | Conference Paper | LibreCat-ID: 9999
Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577., 2018, doi:10.4071/2380-4505-2018.1.000572.
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2018 | Journal Article | LibreCat-ID: 30935
Anderski, Juliane, et al. “Light-Responsive Nanoparticles Based on New Polycarbonate Polymers as Innovative Drug Delivery Systems for Photosensitizers in PDT.” International Journal of Pharmaceutics, vol. 557, Elsevier BV, 2018, pp. 182–91, doi:10.1016/j.ijpharm.2018.12.040.
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2017 | Conference Paper | LibreCat-ID: 9982
Schemmel, Reinhard, et al. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” 43. Deutsche Jahrestagung Für Akustik, 2017, pp. 611–14.
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2017 | Journal Article | LibreCat-ID: 13238
Lücke, Andreas, et al. “Efficient PAW-Based Bond Strength Analysis for Understanding the In/Si(111)(8 × 2) – (4 × 1) Phase Transition.” Journal of Computational Chemistry, vol. 38, no. 26, 2017, pp. 2276–82, doi:10.1002/jcc.24878.
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2016 | Conference Paper | LibreCat-ID: 9955
Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–10, doi:10.1109/ECTC.2016.234.
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2016 | Conference Paper | LibreCat-ID: 9959
Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–18, doi:10.1109/ECTC.2016.91.
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2016 | Conference Paper | LibreCat-ID: 9968
Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–54.
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2014 | Conference Paper | LibreCat-ID: 9868
Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–55, doi:10.1109/ECTC.2014.6897500.
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