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12 Publications
2023 | Dissertation | LibreCat-ID: 41971
Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach
S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.
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S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.
2022 | Conference Paper | LibreCat-ID: 29803
Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design
M. Hesse, M. Hunstig, J. Timmermann, A. Trächtler, in: Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 2022, pp. 383–394.
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M. Hesse, M. Hunstig, J. Timmermann, A. Trächtler, in: Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 2022, pp. 383–394.
2021 | Journal Article | LibreCat-ID: 21436
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.
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R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.
2018 | Conference Paper | LibreCat-ID: 9992
Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process
C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
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C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
2018 | Conference Paper | LibreCat-ID: 9999
Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges
A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.
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| DOI
A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.
2017 | Conference Paper | LibreCat-ID: 9982
MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall
R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.
LibreCat
R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.
2016 | Conference Paper | LibreCat-ID: 9955
Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.
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| DOI
S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.
2016 | Conference Paper | LibreCat-ID: 9959
Effect of different oxide layers on the ultrasonic copper wire bond process
F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.
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| DOI
F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.
2016 | Conference Paper | LibreCat-ID: 9968
Validated Simulation of the Ultrasonic Wire Bonding Process
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.
LibreCat
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.
2014 | Conference Paper | LibreCat-ID: 9868
Improving the bond quality of copper wire bonds using a friction model approach
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
LibreCat
| DOI
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
2014 | Conference Paper | LibreCat-ID: 9895
Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.
LibreCat
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.
2013 | Conference Paper | LibreCat-ID: 9797
A friction based approach for modeling wire bonding
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International Symposium on Microelectronics, Orlando (Florida), USA, 2013.
LibreCat
| DOI
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International Symposium on Microelectronics, Orlando (Florida), USA, 2013.