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12 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Shaker, 2023.
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2022 | Conference Paper | LibreCat-ID: 29803
Hesse, Michael, et al. “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-Forward Control Design.” Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 2022, pp. 383–94.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability, vol. 119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.
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| DOI
2018 | Conference Paper | LibreCat-ID: 9992
Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
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2018 | Conference Paper | LibreCat-ID: 9999
Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577., 2018, doi:10.4071/2380-4505-2018.1.000572.
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2017 | Conference Paper | LibreCat-ID: 9982
Schemmel, Reinhard, et al. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” 43. Deutsche Jahrestagung Für Akustik, 2017, pp. 611–14.
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2016 | Conference Paper | LibreCat-ID: 9955
Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–10, doi:10.1109/ECTC.2016.234.
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| DOI
2016 | Conference Paper | LibreCat-ID: 9959
Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–18, doi:10.1109/ECTC.2016.91.
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2016 | Conference Paper | LibreCat-ID: 9968
Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–54.
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2014 | Conference Paper | LibreCat-ID: 9868
Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–55, doi:10.1109/ECTC.2014.6897500.
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| DOI
2014 | Conference Paper | LibreCat-ID: 9895
Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–94.
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2013 | Conference Paper | LibreCat-ID: 9797
Althoff, Simon, et al. “A Friction Based Approach for Modeling Wire Bonding.” IMAPS 2013, 46th International Symposium on Microelectronics, 2013, doi:10.4071/isom-2013-TA67.
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