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12 Publications
2023 | Dissertation | LibreCat-ID: 41971
@book{Althoff_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach}, volume={15}, publisher={Shaker}, author={Althoff, Simon}, year={2023}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }
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2022 | Conference Paper | LibreCat-ID: 29803
@inproceedings{Hesse_Hunstig_Timmermann_Trächtler_2022, title={Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design}, booktitle={Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)}, author={Hesse, Michael and Hunstig, Matthias and Timmermann, Julia and Trächtler, Ansgar}, year={2022}, pages={383–394} }
LibreCat
2021 | Journal Article | LibreCat-ID: 21436
@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={https://doi.org/10.1016/j.microrel.2021.114077}, journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }
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2018 | Conference Paper | LibreCat-ID: 9992
@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title={Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter}, year={2018}, pages={1–6} }
LibreCat
2018 | Conference Paper | LibreCat-ID: 9999
@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={10.4071/2380-4505-2018.1.000572}, booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter}, year={2018} }
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2017 | Conference Paper | LibreCat-ID: 9982
@inproceedings{Schemmel_Hemsel_Sextro_2017, place={Kiel 2017}, title={MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall}, booktitle={43. Deutsche Jahrestagung für Akustik}, author={Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}, year={2017}, pages={611–614} }
LibreCat
2016 | Conference Paper | LibreCat-ID: 9955
@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent Transmittable Tangential Force of Wire Bond Tools}, DOI={10.1109/ECTC.2016.234}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff, Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian}, year={2016}, pages={2103–2110} }
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2016 | Conference Paper | LibreCat-ID: 9959
@inproceedings{Eacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016, title={Effect of different oxide layers on the ultrasonic copper wire bond process}, DOI={10.1109/ECTC.2016.91}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Eacock, Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach, Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten}, year={2016}, pages={2111–2118} }
LibreCat
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2016 | Conference Paper | LibreCat-ID: 9968
@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={251–254} }
LibreCat
2014 | Conference Paper | LibreCat-ID: 9868
@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the bond quality of copper wire bonds using a friction model approach}, DOI={10.1109/ECTC.2014.6897500}, booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2014}, pages={1549–1555} }
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2014 | Conference Paper | LibreCat-ID: 9895
@inproceedings{Unger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014, place={San Diego, CA, US}, title={Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds}, booktitle={Proceedings of the 47th International Symposium on Microelectronics (IMAPS)}, author={Unger, Andreas and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and Eacock, Florian and Brökelmann, Michael}, year={2014}, pages={289–294} }
LibreCat
2013 | Conference Paper | LibreCat-ID: 9797
@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2013, place={Orlando (Florida), USA}, title={A friction based approach for modeling wire bonding}, DOI={10.4071/isom-2013-TA67}, booktitle={IMAPS 2013, 46th International Symposium on Microelectronics}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2013} }
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