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4 Publications
2021 | Book Chapter | LibreCat-ID: 22930
Self-Piercing Riveting Using Rivets Made of Stainless Steel with High Strain Hardening
B. Uhe, C.-M. Kuball, M. Merklein, G. Meschut, in: G. Daehn, J. Cao, B. Kinsey, E. Tekkaya, A. Vivek, Y. Yoshida (Eds.), Forming the Future - Proceedings of the 13th International Conference on the Technology of Plasticity. The Minerals, Metals & Materials Series., Springer, Cham, 2021, pp. 1495–1506.
LibreCat
| DOI
B. Uhe, C.-M. Kuball, M. Merklein, G. Meschut, in: G. Daehn, J. Cao, B. Kinsey, E. Tekkaya, A. Vivek, Y. Yoshida (Eds.), Forming the Future - Proceedings of the 13th International Conference on the Technology of Plasticity. The Minerals, Metals & Materials Series., Springer, Cham, 2021, pp. 1495–1506.
2015 | Journal Article | LibreCat-ID: 34441
Investigation of wear resistance of dry and cryogenic turned metastable austenitic steel shafts and dry turned and ground carburized steel shafts in the radial shaft seal ring system
D. Frölich, B. Magyar, B. Sauer, P. Mayer, B. Kirsch, J.C. Aurich, R. Skorupski, M. Smaga, T. Beck, D. Eifler, Wear 328–329 (2015) 123–131.
LibreCat
| DOI
D. Frölich, B. Magyar, B. Sauer, P. Mayer, B. Kirsch, J.C. Aurich, R. Skorupski, M. Smaga, T. Beck, D. Eifler, Wear 328–329 (2015) 123–131.
2014 | Conference Paper | LibreCat-ID: 9868
Improving the bond quality of copper wire bonds using a friction model approach
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
LibreCat
| DOI
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
2014 | Conference Paper | LibreCat-ID: 9895
Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.
LibreCat
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.