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12 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff S. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol 15. Shaker; 2023.
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2022 | Conference Paper | LibreCat-ID: 29803
Hesse M, Hunstig M, Timmermann J, Trächtler A. Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design. In: Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM). ; 2022:383-394.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability. 2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077
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2018 | Conference Paper | LibreCat-ID: 9992
Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany). ; 2018:1-6.
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2018 | Conference Paper | LibreCat-ID: 9999
Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:10.4071/2380-4505-2018.1.000572
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2017 | Conference Paper | LibreCat-ID: 9982
Schemmel R, Hemsel T, Sextro W. MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In: 43. Deutsche Jahrestagung Für Akustik. Kiel 2017; 2017:611-614.
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2016 | Conference Paper | LibreCat-ID: 9955
Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In: IEEE 66th Electronic Components and Technology Conference. ; 2016:2103-2110. doi:10.1109/ECTC.2016.234
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2016 | Conference Paper | LibreCat-ID: 9959
Eacock F, Unger A, Eichwald P, et al. Effect of different oxide layers on the ultrasonic copper wire bond process. In: IEEE 66th Electronic Components and Technology Conference. ; 2016:2111-2118. doi:10.1109/ECTC.2016.91
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2016 | Conference Paper | LibreCat-ID: 9968
Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.
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2014 | Conference Paper | LibreCat-ID: 9868
Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper wire bonds using a friction model approach. In: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. ; 2014:1549-1555. doi:10.1109/ECTC.2014.6897500
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2014 | Conference Paper | LibreCat-ID: 9895
Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: Proceedings of the 47th International Symposium on Microelectronics (IMAPS). San Diego, CA, US; 2014:289-294.
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2013 | Conference Paper | LibreCat-ID: 9797
Althoff S, Neuhaus J, Hemsel T, Sextro W. A friction based approach for modeling wire bonding. In: IMAPS 2013, 46th International Symposium on Microelectronics. Orlando (Florida), USA; 2013. doi:10.4071/isom-2013-TA67
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