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12 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff, S. (2023). Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach (Vol. 15). Shaker.
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2022 | Conference Paper | LibreCat-ID: 29803
Hesse, M., Hunstig, M., Timmermann, J., & Trächtler, A. (2022). Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design. Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 383–394.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability, 119, 114077. https://doi.org/10.1016/j.microrel.2021.114077
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2018 | Conference Paper | LibreCat-ID: 9992
Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., & Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany) (pp. 1–6).
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2018 | Conference Paper | LibreCat-ID: 9999
Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., & Sextro, W. (2018). Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018 (Vol. Vol. 2018, No. 1, pp. 000572-000577.). https://doi.org/10.4071/2380-4505-2018.1.000572
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2017 | Conference Paper | LibreCat-ID: 9982
Schemmel, R., Hemsel, T., & Sextro, W. (2017). MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In 43. Deutsche Jahrestagung für Akustik (pp. 611–614). Kiel 2017.
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2016 | Conference Paper | LibreCat-ID: 9955
Althoff, S., Meyer, T., Unger, A., Sextro, W., & Eacock, F. (2016). Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In IEEE 66th Electronic Components and Technology Conference (pp. 2103–2110). https://doi.org/10.1109/ECTC.2016.234
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2016 | Conference Paper | LibreCat-ID: 9959
Eacock, F., Unger, A., Eichwald, P., Grydin, O., Hengsbach, F., Althoff, S., … Guth, K. (2016). Effect of different oxide layers on the ultrasonic copper wire bond process. In IEEE 66th Electronic Components and Technology Conference (pp. 2111–2118). https://doi.org/10.1109/ECTC.2016.91
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2016 | Conference Paper | LibreCat-ID: 9968
Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S., … Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process. In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016 (pp. 251–254). IEEE CPMT Symposium Japan.
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2014 | Conference Paper | LibreCat-ID: 9868
Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555). https://doi.org/10.1109/ECTC.2014.6897500
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2014 | Conference Paper | LibreCat-ID: 9895
Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., & Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In Proceedings of the 47th International Symposium on Microelectronics (IMAPS) (pp. 289–294). San Diego, CA, US.
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2013 | Conference Paper | LibreCat-ID: 9797
Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2013). A friction based approach for modeling wire bonding. In IMAPS 2013, 46th International Symposium on Microelectronics. Orlando (Florida), USA. https://doi.org/10.4071/isom-2013-TA67
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