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12 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol. 15. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2023.
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2022 | Conference Paper | LibreCat-ID: 29803
Hesse, Michael, Matthias Hunstig, Julia Timmermann, and Ansgar Trächtler. “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-Forward Control Design.” In Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 383–94, 2022.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability 119 (2021): 114077. https://doi.org/10.1016/j.microrel.2021.114077.
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2018 | Conference Paper | LibreCat-ID: 9992
Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 1–6, 2018.
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2018 | Conference Paper | LibreCat-ID: 9999
Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, Vol. Vol. 2018, No. 1, pp. 000572-000577., 2018. https://doi.org/10.4071/2380-4505-2018.1.000572.
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2017 | Conference Paper | LibreCat-ID: 9982
Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” In 43. Deutsche Jahrestagung Für Akustik, 611–14. Kiel 2017, 2017.
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2016 | Conference Paper | LibreCat-ID: 9955
Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In IEEE 66th Electronic Components and Technology Conference, 2103–10, 2016. https://doi.org/10.1109/ECTC.2016.234.
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2016 | Conference Paper | LibreCat-ID: 9959
Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” In IEEE 66th Electronic Components and Technology Conference, 2111–18, 2016. https://doi.org/10.1109/ECTC.2016.91.
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2016 | Conference Paper | LibreCat-ID: 9968
Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 251–54. IEEE CPMT Symposium Japan, 2016.
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2014 | Conference Paper | LibreCat-ID: 9868
Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 1549–55, 2014. https://doi.org/10.1109/ECTC.2014.6897500.
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2014 | Conference Paper | LibreCat-ID: 9895
Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer, Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 289–94. San Diego, CA, US, 2014.
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2013 | Conference Paper | LibreCat-ID: 9797
Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “A Friction Based Approach for Modeling Wire Bonding.” In IMAPS 2013, 46th International Symposium on Microelectronics. Orlando (Florida), USA, 2013. https://doi.org/10.4071/isom-2013-TA67.
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