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34 Publications
2024 | Conference Paper | LibreCat-ID: 57185
F. Reiling, C. Henke, M. Hunstig, S. Gröger, and A. Trächtler, “Batch constrained multi-objective Bayesian optimization using the example of ultrasonic wire bonding,” 2024, doi: 10.1109/aim55361.2024.10637123.
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| DOI
2022 | Conference Paper | LibreCat-ID: 29803
M. Hesse, M. Hunstig, J. Timmermann, and A. Trächtler, “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design,” in Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), Online, 2022, pp. 383–394.
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2019 | Conference Paper | LibreCat-ID: 15412
R. Schemmel et al., “Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding,” in International Symposium on Microelectronics, Boston, 2019, pp. 509–514, doi: 10.4071/2380-4505-2019.1.000509.
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| Files available
| DOI
2019 | Journal Article | LibreCat-ID: 10334
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,” Sensors and Actuators A: Physical, vol. 295, pp. 653–662, 2019, doi: 10.1016/j.sna.2019.04.025.
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| DOI
2018 | Conference Paper | LibreCat-ID: 9992
C. Dymel et al., “Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process,” in (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
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2018 | Conference Paper | LibreCat-ID: 9993
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig, “Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding,” in (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
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2018 | Conference Paper | LibreCat-ID: 9997
R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, and M. Hunstig, “Effects of different working frequencies on the joint formation in copper wire bonding,” in CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), 2018, pp. 230–235.
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2018 | Conference Paper | LibreCat-ID: 9999
A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges,” in In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.
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| DOI
2017 | Journal Article | LibreCat-ID: 9973
P. Eichwald et al., “Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design,” IMAPSource, vol. Vol. 2017, No. 1, 2017.
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2016 | Journal Article | LibreCat-ID: 9957
M. Brökelmann et al., “Kupferbondverbindungen intelligent herstellen,” wt-online, vol. 7/8, pp. 512–519, 2016.
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2016 | Conference Paper | LibreCat-ID: 9968
A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–254.
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2014 | Dissertation | LibreCat-ID: 9875
M. Hunstig, Konzeption, Ansteuerung und Eigenschaften schneller piezoelektrischer Trägheitsmotoren. Shaker, 2014.
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2013 | Conference Paper | LibreCat-ID: 9796
W. Al-Ashtari, M. Hunstig, T. Hemsel, and W. Sextro, “Characteristics of Piezoelectric Energy Harvesters in Autonomous Systems,” in Proceedings of 10th International Workshop on Piezoelectric Materials and Applications and 8th Energy Harvesting Workshop, Hannover, Germany, 14.-17.7.2013, 2013, no. 05/2013, pp. 159–161.
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2013 | Conference Paper | LibreCat-ID: 9801
M. Hunstig, W. Al-Ashtari, T. Hemsel, and W. Sextro, “Leistungs- und Bandbreitensteigerung von Energy-Harvesting-Generatoren für Energieautarke Systeme,” in 9. Paderborner Workshop Entwurf mechatronischer Systeme, 2013, pp. 359–372.
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