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34 Publications


2024 | Conference Paper | LibreCat-ID: 57185
Batch constrained multi-objective Bayesian optimization using the example of ultrasonic wire bonding
F. Reiling, C. Henke, M. Hunstig, S. Gröger, A. Trächtler, in: 2024 IEEE International Conference on Advanced Intelligent Mechatronics (AIM), IEEE, 2024.
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2022 | Conference Paper | LibreCat-ID: 29803
Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design
M. Hesse, M. Hunstig, J. Timmermann, A. Trächtler, in: Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 2022, pp. 383–394.
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2019 | Conference Paper | LibreCat-ID: 15412
Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding
R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann, W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 509–514.
LibreCat | Files available | DOI
 

2019 | Journal Article | LibreCat-ID: 10334
Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.
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2018 | Conference Paper | LibreCat-ID: 9992
Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process
C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
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2018 | Conference Paper | LibreCat-ID: 9993
Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
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2018 | Conference Paper | LibreCat-ID: 9997
Effects of different working frequencies on the joint formation in copper wire bonding
R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, in: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.
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2018 | Conference Paper | LibreCat-ID: 9999
Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges
A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.
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2017 | Journal Article | LibreCat-ID: 9973
Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).
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2017 | Journal Article | LibreCat-ID: 9975 LibreCat | DOI
 

2016 | Journal Article | LibreCat-ID: 9957
Kupferbondverbindungen intelligent herstellen
M. Brökelmann, A. Unger, T. Meyer, S. Althoff, W. Sextro, M. Hunstig, F. Biermann, K. Guth, Wt-Online 7/8 (2016) 512–519.
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2016 | Conference Paper | LibreCat-ID: 9966
Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.
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2016 | Conference Paper | LibreCat-ID: 9968
Validated Simulation of the Ultrasonic Wire Bonding Process
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.
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2015 | Conference Paper | LibreCat-ID: 9951
Modeling and simulation of the ultrasonic wire bonding process
T. Meyer, A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: 2015 17th Electronics Packaging Technology Conference, 2015.
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2014 | Journal Article | LibreCat-ID: 9876
High-velocity operation of piezoelectric inertia motors: experimental validation
M. Hunstig, T. Hemsel, W. Sextro, Archive of Applied Mechanics (2014) 1–9.
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2014 | Dissertation | LibreCat-ID: 9875
Konzeption, Ansteuerung und Eigenschaften schneller piezoelektrischer Trägheitsmotoren
M. Hunstig, Konzeption, Ansteuerung Und Eigenschaften Schneller Piezoelektrischer Trägheitsmotoren, Shaker, 2014.
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2013 | Journal Article | LibreCat-ID: 9794
Increasing the power of piezoelectric energy harvesters by magnetic stiffening
W. Al-Ashtari, M. Hunstig, T. Hemsel, W. Sextro, Journal of Intelligent Material Systems and Structures 24 (2013) 1332–1342.
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2013 | Journal Article | LibreCat-ID: 9795
Enhanced energy harvesting using multiple piezoelectric elements: Theory and experiments
W. Al-Ashtari, M. Hunstig, T. Hemsel, W. Sextro, Sensors and Actuators A: Physical 200 (2013) 138–146.
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2013 | Conference Paper | LibreCat-ID: 9796
Characteristics of Piezoelectric Energy Harvesters in Autonomous Systems
W. Al-Ashtari, M. Hunstig, T. Hemsel, W. Sextro, in: Proceedings of 10th International Workshop on Piezoelectric Materials and Applications and 8th Energy Harvesting Workshop, Hannover, Germany, 14.-17.7.2013, Hannover, Germany, 2013, pp. 159–161.
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2013 | Conference Paper | LibreCat-ID: 9801
Leistungs- und Bandbreitensteigerung von Energy-Harvesting-Generatoren für Energieautarke Systeme
M. Hunstig, W. Al-Ashtari, T. Hemsel, W. Sextro, in: J. Gausemeier, R. Dumitrescu, F. Rammig, W. Schäfer, A. Trächtler (Eds.), 9. Paderborner Workshop Entwurf Mechatronischer Systeme, Heinz Nixdorf Institut, Universität Paderborn, Paderborn, 2013, pp. 359–372.
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