Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method

F. Dahms, W. Homberg, in: Forming the Future, Cham, 2021.

Download
No fulltext has been uploaded.
Book Chapter | Published | English
Author
;
Publishing Year
Book Title
Forming the Future
Conference
The 13th International Conference on the Technology of Plasticity
Conference Location
Ohio, USA, VIRTUAL EVENT
Conference Date
2021-07-25 – 2021-07-30
LibreCat-ID

Cite this

Dahms F, Homberg W. Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method. In: Forming the Future. Cham; 2021. doi:10.1007/978-3-030-75381-8_189
Dahms, F., & Homberg, W. (2021). Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method. In Forming the Future. Cham. https://doi.org/10.1007/978-3-030-75381-8_189
@inbook{Dahms_Homberg_2021, place={Cham}, title={Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method}, DOI={10.1007/978-3-030-75381-8_189}, booktitle={Forming the Future}, author={Dahms, Frederik and Homberg, Werner}, year={2021} }
Dahms, Frederik, and Werner Homberg. “Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method.” In Forming the Future. Cham, 2021. https://doi.org/10.1007/978-3-030-75381-8_189.
F. Dahms and W. Homberg, “Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method,” in Forming the Future, Cham, 2021.
Dahms, Frederik, and Werner Homberg. “Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method.” Forming the Future, 2021, doi:10.1007/978-3-030-75381-8_189.

Export

Marked Publications

Open Data LibreCat

Search this title in

Google Scholar