Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method
F. Dahms, W. Homberg, in: Forming the Future, Springer, Cham, 2021, pp. 2249–2259.
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Book Chapter
| Published
| English
Department
Publishing Year
Book Title
Forming the Future
Page
2249-2259
Conference
The 13th International Conference on the Technology of Plasticity
Conference Location
Ohio, USA, VIRTUAL EVENT
Conference Date
2021-07-25 – 2021-07-30
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Dahms F, Homberg W. Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method. In: Forming the Future. Springer, Cham; 2021:2249-2259. doi:10.1007/978-3-030-75381-8_189
Dahms, F., & Homberg, W. (2021). Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method. In Forming the Future (pp. 2249–2259). Springer, Cham. https://doi.org/10.1007/978-3-030-75381-8_189
@inbook{Dahms_Homberg_2021, title={Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method}, DOI={10.1007/978-3-030-75381-8_189}, booktitle={Forming the Future}, publisher={Springer, Cham}, author={Dahms, Frederik and Homberg, Werner}, year={2021}, pages={2249–2259} }
Dahms, Frederik, and Werner Homberg. “Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method.” In Forming the Future, 2249–59. Springer, Cham, 2021. https://doi.org/10.1007/978-3-030-75381-8_189.
F. Dahms and W. Homberg, “Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method,” in Forming the Future, Springer, Cham, 2021, pp. 2249–2259.
Dahms, Frederik, and Werner Homberg. “Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method.” Forming the Future, Springer, Cham, 2021, pp. 2249–59, doi:10.1007/978-3-030-75381-8_189.
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