Flip-Chip Package with Integrated Antenna on a Polyimide Substrate for a 122-GHz Bistatic Radar IC

S. Beer, M.G. Girma, Y. Sun, W. Winkler, W. Debski, J. Paaso, G. Kunkel, C. Scheytt, J. Hasch, T. Zwick, in: 7th EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION, Gothenburg, Sweden, 2013.

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This paper presents the packaging technology and the integrated antenna design for a miniaturized 122-GHz radar sensor. The package layout and the assembly process are shortly explained. Measurements of the antenna including the flip chip interconnect are presented that have been achieved by replacing the IC with a dummy chip that only contains a through-line. Afterwards, radiation pattern measurements are shown that were recorded using the radar sensor as transmitter. Finally, details of the fully integrated radar sensor are given, together with results of the first Doppler measurements.
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7th EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION
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Beer S, Girma MG, Sun Y, et al. Flip-Chip Package with Integrated Antenna on a Polyimide Substrate for a 122-GHz Bistatic Radar IC. In: 7th EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION. ; 2013.
Beer, S., Girma, M. G., Sun, Y., Winkler, W., Debski, W., Paaso, J., Kunkel, G., Scheytt, C., Hasch, J., & Zwick, T. (2013). Flip-Chip Package with Integrated Antenna on a Polyimide Substrate for a 122-GHz Bistatic Radar IC. 7th EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION.
@inproceedings{Beer_Girma_Sun_Winkler_Debski_Paaso_Kunkel_Scheytt_Hasch_Zwick_2013, place={Gothenburg, Sweden}, title={Flip-Chip Package with Integrated Antenna on a Polyimide Substrate for a 122-GHz Bistatic Radar IC}, booktitle={7th EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION}, author={Beer, Stefan and Girma, Mekdes Gebresilassie and Sun, Yaoming and Winkler, Wolfgang and Debski, Wojciech and Paaso, Jaska and Kunkel, Gerhard and Scheytt, Christoph and Hasch, Jürgen and Zwick, Thomas}, year={2013} }
Beer, Stefan, Mekdes Gebresilassie Girma, Yaoming Sun, Wolfgang Winkler, Wojciech Debski, Jaska Paaso, Gerhard Kunkel, Christoph Scheytt, Jürgen Hasch, and Thomas Zwick. “Flip-Chip Package with Integrated Antenna on a Polyimide Substrate for a 122-GHz Bistatic Radar IC.” In 7th EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION. Gothenburg, Sweden, 2013.
S. Beer et al., “Flip-Chip Package with Integrated Antenna on a Polyimide Substrate for a 122-GHz Bistatic Radar IC,” 2013.
Beer, Stefan, et al. “Flip-Chip Package with Integrated Antenna on a Polyimide Substrate for a 122-GHz Bistatic Radar IC.” 7th EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION, 2013.

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