Dynamic Multi-Frequency Test Method for Hidden Interconnect Defects

S. Sadeghi-Kohan, S. Hellebrand, in: 38th IEEE VLSI Test Symposium (VTS), IEEE, Virtual Conference - Originally San Diego, CA, USA, 2020.

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Conference Paper | Published | English
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38th IEEE VLSI Test Symposium (VTS)
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Sadeghi-Kohan S, Hellebrand S. Dynamic Multi-Frequency Test Method for Hidden Interconnect Defects. In: 38th IEEE VLSI Test Symposium (VTS). IEEE; 2020. doi:10.1109/vts48691.2020.9107591
Sadeghi-Kohan, S., & Hellebrand, S. (2020). Dynamic Multi-Frequency Test Method for Hidden Interconnect Defects. 38th IEEE VLSI Test Symposium (VTS). https://doi.org/10.1109/vts48691.2020.9107591
@inproceedings{Sadeghi-Kohan_Hellebrand_2020, place={Virtual Conference - Originally San Diego, CA, USA}, title={Dynamic Multi-Frequency Test Method for Hidden Interconnect Defects}, DOI={10.1109/vts48691.2020.9107591}, booktitle={38th IEEE VLSI Test Symposium (VTS)}, publisher={IEEE}, author={Sadeghi-Kohan, Somayeh and Hellebrand, Sybille}, year={2020} }
Sadeghi-Kohan, Somayeh, and Sybille Hellebrand. “Dynamic Multi-Frequency Test Method for Hidden Interconnect Defects.” In 38th IEEE VLSI Test Symposium (VTS). Virtual Conference - Originally San Diego, CA, USA: IEEE, 2020. https://doi.org/10.1109/vts48691.2020.9107591.
S. Sadeghi-Kohan and S. Hellebrand, “Dynamic Multi-Frequency Test Method for Hidden Interconnect Defects,” 2020, doi: 10.1109/vts48691.2020.9107591.
Sadeghi-Kohan, Somayeh, and Sybille Hellebrand. “Dynamic Multi-Frequency Test Method for Hidden Interconnect Defects.” 38th IEEE VLSI Test Symposium (VTS), IEEE, 2020, doi:10.1109/vts48691.2020.9107591.

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