A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material
B. Mecke, P. Schuster, J. von Reinersdorff, T. Mager, J. Diri, R. Dumitrescu, in: 2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress), IEEE, 2026.
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Author
Mecke, Bruno;
Schuster, Paul;
von Reinersdorff, Johannes;
Mager, Thomas;
Diri, Jabil;
Dumitrescu, RomanLibreCat
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2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress)
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Mecke B, Schuster P, von Reinersdorff J, Mager T, Diri J, Dumitrescu R. A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material. In: 2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress). IEEE; 2026. doi:10.1109/midcongress66428.2025.11547377
Mecke, B., Schuster, P., von Reinersdorff, J., Mager, T., Diri, J., & Dumitrescu, R. (2026). A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material. 2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress). https://doi.org/10.1109/midcongress66428.2025.11547377
@inproceedings{Mecke_Schuster_von Reinersdorff_Mager_Diri_Dumitrescu_2026, title={A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material}, DOI={10.1109/midcongress66428.2025.11547377}, booktitle={2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress)}, publisher={IEEE}, author={Mecke, Bruno and Schuster, Paul and von Reinersdorff, Johannes and Mager, Thomas and Diri, Jabil and Dumitrescu, Roman}, year={2026} }
Mecke, Bruno, Paul Schuster, Johannes von Reinersdorff, Thomas Mager, Jabil Diri, and Roman Dumitrescu. “A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material.” In 2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress). IEEE, 2026. https://doi.org/10.1109/midcongress66428.2025.11547377.
B. Mecke, P. Schuster, J. von Reinersdorff, T. Mager, J. Diri, and R. Dumitrescu, “A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material,” 2026, doi: 10.1109/midcongress66428.2025.11547377.
Mecke, Bruno, et al. “A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material.” 2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress), IEEE, 2026, doi:10.1109/midcongress66428.2025.11547377.
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