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1 Publication
2019 | Conference Paper | LibreCat-ID: 15412
R. Schemmel et al., “Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding,” in International Symposium on Microelectronics, Boston, 2019, pp. 509–514, doi: 10.4071/2380-4505-2019.1.000509.
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