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1 Publication
2019 | Conference Paper | LibreCat-ID: 15412
Schemmel, Reinhard, et al. “Impact of Multi-Dimensional Vibration Trajectories on Quality and Failure Modes in Ultrasonic Bonding.” International Symposium on Microelectronics, 2019, pp. 509–14, doi:10.4071/2380-4505-2019.1.000509.
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