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1 Publication
2019 | Conference Paper | LibreCat-ID: 15412
Schemmel, R., Eacock, F., Dymel, C., Hemsel, T., Hunstig, M., Brökelmann, M., & Sextro, W. (2019). Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding. International Symposium on Microelectronics, 509–514. https://doi.org/10.4071/2380-4505-2019.1.000509
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