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1 Publication
2019 | Conference Paper | LibreCat-ID: 15412
@inproceedings{Schemmel_Eacock_Dymel_Hemsel_Hunstig_Brökelmann_Sextro_2019, title={Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding}, DOI={10.4071/2380-4505-2019.1.000509}, booktitle={International Symposium on Microelectronics}, author={Schemmel, Reinhard and Eacock, Florian and Dymel, Collin and Hemsel, Tobias and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={509–514} }
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