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20 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol. 15. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2023.
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2023 | Journal Article | LibreCat-ID: 43371
Voswinkel, Dietrich. “Application of a New Strategy for Time-Efficient Laser Treatment of Galvanized Steel Substrates to Improve the Adhesion Properties.” Journal of Manufacturing Processes 94 (2023): 10–19. https://doi.org//10.1016/j.jmapro.2023.03.056.
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2022 | Journal Article | LibreCat-ID: 33988
Moritzer, Elmar, and Christine Driediger. “Reactive Direct Bonding of Digital Light Process Components.” Macromolecular Symposia 404, no. 1 (2022). https://doi.org/10.1002/masy.202100396.
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2022 | Conference Paper | LibreCat-ID: 29803
Hesse, Michael, Matthias Hunstig, Julia Timmermann, and Ansgar Trächtler. “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-Forward Control Design.” In Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 383–94, 2022.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability 119 (2021): 114077. https://doi.org/10.1016/j.microrel.2021.114077.
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2019 | Dissertation | LibreCat-ID: 41958
Opdemom, Hermann. Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen. Vol. 2019,35. Schriftenreihe Institut für Leichtbau mit Hybridsystemen. Shaker Verlag, 2019.
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2019 | Journal Article | LibreCat-ID: 10334
Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical 295 (2019): 653–62. https://doi.org/10.1016/j.sna.2019.04.025.
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2018 | Conference Paper | LibreCat-ID: 9992
Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 1–6, 2018.
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2018 | Conference Paper | LibreCat-ID: 9993
Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 41–44, 2018.
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2018 | Conference Paper | LibreCat-ID: 9999
Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, Vol. Vol. 2018, No. 1, pp. 000572-000577., 2018. https://doi.org/10.4071/2380-4505-2018.1.000572.
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2017 | Conference Paper | LibreCat-ID: 9982
Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” In 43. Deutsche Jahrestagung Für Akustik, 611–14. Kiel 2017, 2017.
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2017 | Journal Article | LibreCat-ID: 13238
Lücke, Andreas, Uwe Gerstmann, Thomas D. Kühne, and Wolf G. Schmidt. “Efficient PAW-Based Bond Strength Analysis for Understanding the In/Si(111)(8 × 2) – (4 × 1) Phase Transition.” Journal of Computational Chemistry 38, no. 26 (2017): 2276–82. https://doi.org/10.1002/jcc.24878.
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2016 | Conference Paper | LibreCat-ID: 9955
Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In IEEE 66th Electronic Components and Technology Conference, 2103–10, 2016. https://doi.org/10.1109/ECTC.2016.234.
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2016 | Conference Paper | LibreCat-ID: 9959
Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” In IEEE 66th Electronic Components and Technology Conference, 2111–18, 2016. https://doi.org/10.1109/ECTC.2016.91.
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2016 | Conference Paper | LibreCat-ID: 9968
Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 251–54. IEEE CPMT Symposium Japan, 2016.
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2014 | Conference Paper | LibreCat-ID: 9868
Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 1549–55, 2014. https://doi.org/10.1109/ECTC.2014.6897500.
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2014 | Conference Paper | LibreCat-ID: 9870
Eacock , Florian, Mirko Schaper, Simon Althoff, Andreas Unger, Paul Eichwald, Florian Hengsbach, Carolin Zinn, Martin Joachim Holzweissig, and Karsten Guth. “Microstructural Investigations of Aluminum and Copper Wire Bonds.” In Proceedings of the 47th International Symposium on Microelectronics, 2014. https://doi.org/10.4071/isom-THP32.
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2014 | Conference Paper | LibreCat-ID: 9871
Eichwald, Paul, Walter Sextro, Simon Althof, Florian Eacock, Andreas Unger, Tobias Meyer, and Karsten Guth. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” In Proceedings of the 47th International Symposium on Microelectronics, 856–61, 2014. https://doi.org/10.4071/isom-THP34.
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2014 | Conference Paper | LibreCat-ID: 9895
Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer, Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 289–94. San Diego, CA, US, 2014.
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2013 | Conference Paper | LibreCat-ID: 9797
Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “A Friction Based Approach for Modeling Wire Bonding.” In IMAPS 2013, 46th International Symposium on Microelectronics. Orlando (Florida), USA, 2013. https://doi.org/10.4071/isom-2013-TA67.
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