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20 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol. 15. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2023.
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2023 | Journal Article | LibreCat-ID: 43371
Voswinkel, Dietrich. “Application of a New Strategy for Time-Efficient Laser Treatment of Galvanized Steel Substrates to Improve the Adhesion Properties.” Journal of Manufacturing Processes 94 (2023): 10–19. https://doi.org//10.1016/j.jmapro.2023.03.056.
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2022 | Journal Article | LibreCat-ID: 33988
Moritzer, Elmar, and Christine Driediger. “Reactive Direct Bonding of Digital Light Process Components.” Macromolecular Symposia 404, no. 1 (2022). https://doi.org/10.1002/masy.202100396.
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2022 | Conference Paper | LibreCat-ID: 29803
Hesse, Michael, Matthias Hunstig, Julia Timmermann, and Ansgar Trächtler. “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-Forward Control Design.” In Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 383–94, 2022.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability 119 (2021): 114077. https://doi.org/10.1016/j.microrel.2021.114077.
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2019 | Dissertation | LibreCat-ID: 41958
Opdemom, Hermann. Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen. Vol. 2019,35. Schriftenreihe Institut für Leichtbau mit Hybridsystemen. Shaker Verlag, 2019.
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2019 | Journal Article | LibreCat-ID: 10334
Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical 295 (2019): 653–62. https://doi.org/10.1016/j.sna.2019.04.025.
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2018 | Conference Paper | LibreCat-ID: 9992
Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 1–6, 2018.
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2018 | Conference Paper | LibreCat-ID: 9993
Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 41–44, 2018.
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2018 | Conference Paper | LibreCat-ID: 9999
Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, Vol. Vol. 2018, No. 1, pp. 000572-000577., 2018. https://doi.org/10.4071/2380-4505-2018.1.000572.
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