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2 Publications
2014 | Conference Paper | LibreCat-ID: 9868
Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper wire bonds using a friction model approach. In: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. ; 2014:1549-1555. doi:10.1109/ECTC.2014.6897500
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 36918
Becker M, Kuznik C, Müller W. Fault Effect Modeling in a Heterogeneous SystemC Based Virtual Platform Framework for Cyber Physical Systems. In: IEEE; 2014. doi:10.1109/ICCPS.2014.6843726
LibreCat
| DOI