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2 Publications
2014 | Conference Paper | LibreCat-ID: 9868
Improving the bond quality of copper wire bonds using a friction model approach
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
LibreCat
| DOI
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
2014 | Conference Paper | LibreCat-ID: 36918
Fault Effect Modeling in a Heterogeneous SystemC Based Virtual Platform Framework for Cyber Physical Systems
M. Becker, C. Kuznik, W. Müller, in: IEEE, Berlin, 2014.
LibreCat
| DOI
M. Becker, C. Kuznik, W. Müller, in: IEEE, Berlin, 2014.