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2 Publications
2014 | Conference Paper | LibreCat-ID: 9868
Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–55, doi:10.1109/ECTC.2014.6897500.
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 36918
Becker, Markus, et al. Fault Effect Modeling in a Heterogeneous SystemC Based Virtual Platform Framework for Cyber Physical Systems. IEEE, 2014, doi:10.1109/ICCPS.2014.6843726.
LibreCat
| DOI