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2 Publications
2014 | Conference Paper | LibreCat-ID: 9868
Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555). https://doi.org/10.1109/ECTC.2014.6897500
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 36918
Becker, M., Kuznik, C., & Müller, W. (2014). Fault Effect Modeling in a Heterogeneous SystemC Based Virtual Platform Framework for Cyber Physical Systems. ACM/IEEE International Conference on Cyber-Physical Systems (ICCPS), Berlin. https://doi.org/10.1109/ICCPS.2014.6843726
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| DOI