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2 Publications


2014 | Conference Paper | LibreCat-ID: 9868
S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality of copper wire bonds using a friction model approach,” in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
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2014 | Conference Paper | LibreCat-ID: 36918
M. Becker, C. Kuznik, and W. Müller, “Fault Effect Modeling in a Heterogeneous SystemC Based Virtual Platform Framework for Cyber Physical Systems,” presented at the ACM/IEEE International Conference on Cyber-Physical Systems (ICCPS), Berlin, 2014, doi: 10.1109/ICCPS.2014.6843726.
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