Please note that LibreCat no longer supports Internet Explorer versions 8 or 9 (or earlier).
We recommend upgrading to the latest Internet Explorer, Google Chrome, or Firefox.
12 Publications
2014 | Conference Paper | LibreCat-ID: 9895
Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.
LibreCat
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.
2013 | Conference Paper | LibreCat-ID: 9797
A friction based approach for modeling wire bonding
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International Symposium on Microelectronics, Orlando (Florida), USA, 2013.
LibreCat
| DOI
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International Symposium on Microelectronics, Orlando (Florida), USA, 2013.