Please note that LibreCat no longer supports Internet Explorer versions 8 or 9 (or earlier).
We recommend upgrading to the latest Internet Explorer, Google Chrome, or Firefox.
12 Publications
2014 | Conference Paper | LibreCat-ID: 9895
Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., & Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In Proceedings of the 47th International Symposium on Microelectronics (IMAPS) (pp. 289–294). San Diego, CA, US.
LibreCat
2013 | Conference Paper | LibreCat-ID: 9797
Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2013). A friction based approach for modeling wire bonding. In IMAPS 2013, 46th International Symposium on Microelectronics. Orlando (Florida), USA. https://doi.org/10.4071/isom-2013-TA67
LibreCat
| DOI