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12 Publications
2014 | Conference Paper | LibreCat-ID: 9895
Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer, Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 289–94. San Diego, CA, US, 2014.
LibreCat
2013 | Conference Paper | LibreCat-ID: 9797
Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “A Friction Based Approach for Modeling Wire Bonding.” In IMAPS 2013, 46th International Symposium on Microelectronics. Orlando (Florida), USA, 2013. https://doi.org/10.4071/isom-2013-TA67.
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