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12 Publications


2014 | Conference Paper | LibreCat-ID: 9895
A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–294.
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2013 | Conference Paper | LibreCat-ID: 9797
S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “A friction based approach for modeling wire bonding,” in IMAPS 2013, 46th International Symposium on Microelectronics, 2013.
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