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5 Publications
2022 | Conference Paper | LibreCat-ID: 34104
Scheidemann C, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE; 2022. doi:10.1109/estc55720.2022.9939478
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| DOI
2019 | Conference Paper | LibreCat-ID: 15412
Schemmel R, Eacock F, Dymel C, et al. Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding. In: International Symposium on Microelectronics. ; 2019:509-514. doi:10.4071/2380-4505-2019.1.000509
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| Files available
| DOI
2019 | Journal Article | LibreCat-ID: 10334
Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical. 2019;295:653-662. doi:10.1016/j.sna.2019.04.025
LibreCat
| DOI
2017 | Journal Article | LibreCat-ID: 9973
Eichwald P, Althoff S, Schemmel R, et al. Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design. IMAPSource. 2017;Vol. 2017, No. 1.
LibreCat
2014 | Conference Paper | LibreCat-ID: 9895
Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: Proceedings of the 47th International Symposium on Microelectronics (IMAPS). San Diego, CA, US; 2014:289-294.
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