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5 Publications
2022 | Conference Paper | LibreCat-ID: 34104
C. Scheidemann, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding,” 2022, doi: 10.1109/estc55720.2022.9939478.
LibreCat
| DOI
2019 | Conference Paper | LibreCat-ID: 15412
R. Schemmel et al., “Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding,” in International Symposium on Microelectronics, Boston, 2019, pp. 509–514, doi: 10.4071/2380-4505-2019.1.000509.
LibreCat
| Files available
| DOI
2019 | Journal Article | LibreCat-ID: 10334
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,” Sensors and Actuators A: Physical, vol. 295, pp. 653–662, 2019, doi: 10.1016/j.sna.2019.04.025.
LibreCat
| DOI
2017 | Journal Article | LibreCat-ID: 9973
P. Eichwald et al., “Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design,” IMAPSource, vol. Vol. 2017, No. 1, 2017.
LibreCat
2014 | Conference Paper | LibreCat-ID: 9895
A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–294.
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