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5 Publications
2022 | Conference Paper | LibreCat-ID: 34104
Scheidemann, Claus, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” In 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE, 2022. https://doi.org/10.1109/estc55720.2022.9939478.
LibreCat
| DOI
2019 | Conference Paper | LibreCat-ID: 15412
Schemmel, Reinhard, Florian Eacock, Collin Dymel, Tobias Hemsel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Impact of Multi-Dimensional Vibration Trajectories on Quality and Failure Modes in Ultrasonic Bonding.” In International Symposium on Microelectronics, 509–14, 2019. https://doi.org/10.4071/2380-4505-2019.1.000509.
LibreCat
| Files available
| DOI
2019 | Journal Article | LibreCat-ID: 10334
Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical 295 (2019): 653–62. https://doi.org/10.1016/j.sna.2019.04.025.
LibreCat
| DOI
2017 | Journal Article | LibreCat-ID: 9973
Eichwald, Paul, Simon Althoff, Reinhard Schemmel, Walter Sextro, Andreas Unger, Michael Brökelmann, and Matthias Hunstig. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design.” IMAPSource Vol. 2017, No. 1 (2017).
LibreCat
2014 | Conference Paper | LibreCat-ID: 9895
Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer, Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 289–94. San Diego, CA, US, 2014.
LibreCat