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9 Publications


2022 | Journal Article | LibreCat-ID: 34648
C. Hoppe et al., “Influence of surface activation on the microporosity of PE‐CVD and PE‐ALD SiO                          x                        thin films on PDMS,” Plasma Processes and Polymers, vol. 19, no. 4, Art. no. 2100174, 2022, doi: 10.1002/ppap.202100174.
LibreCat | DOI
 

2021 | Journal Article | LibreCat-ID: 34645
T. S. Tripathi et al., “Atomic Layer Deposition of Copper Metal Films from Cu(acac)            2            and Hydroquinone Reductant,” Advanced Engineering Materials, vol. 23, no. 10, Art. no. 2100446, 2021, doi: 10.1002/adem.202100446.
LibreCat | DOI
 

2019 | Journal Article | LibreCat-ID: 22833
L. Mai et al., “Low-Temperature Plasma-Enhanced Atomic Layer Deposition of Tin(IV) Oxide from a Functionalized Alkyl Precursor: Fabrication and Evaluation of SnO2-Based Thin-Film Transistor Devices,” ACS Applied Materials & Interfaces, pp. 3169–3180, 2019.
LibreCat | DOI
 

2018 | Journal Article | LibreCat-ID: 22839
M. Gebhard et al., “A combinatorial approach to enhance barrier properties of thin films on polymers: Seeding and capping of PECVD thin films by PEALD,” Plasma Processes and Polymers, 2018.
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2017 | Journal Article | LibreCat-ID: 22849
C. Hoppe, F. Mitschker, I. Giner, T. de los Arcos, P. Awakowicz, and G. Grundmeier, “Influence of organic surface chemistry on the nucleation of plasma deposited SiOxfilms,” Journal of Physics D: Applied Physics, 2017.
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