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39 Publications
2023 | Dissertation | LibreCat-ID: 41971
@book{Althoff_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach}, volume={15}, publisher={Shaker}, author={Althoff, Simon}, year={2023}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }
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2023 | Conference Abstract | LibreCat-ID: 47234
@inproceedings{Sehlmeyer_Kampmann_Scheidemann_Hemsel_Getzlaff_2023, title={Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells}, booktitle={Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM)}, author={Sehlmeyer, Birte and Kampmann, Rebecca and Scheidemann, Claus and Hemsel, Tobias and Getzlaff, Mathias }, editor={Deutsche Physikalische Gesellschaft e. V.}, year={2023} }
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2023 | Conference Abstract | LibreCat-ID: 47235
@inproceedings{Kampmann_Sehlmeyer_Scheidemann_Hemsel_Getzlaff_2023, title={Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells}, booktitle={Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM)}, author={Kampmann, Rebecca and Sehlmeyer, Birte and Scheidemann, Claus and Hemsel, Tobias and Getzlaff, Mathias}, editor={Deutsche Physikalische Gesellschaft e. V.}, year={2023} }
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2023 | Conference Abstract | LibreCat-ID: 51117
@inproceedings{Scheidemann_Hemsel_Friesen_Claes_Sextro_2023, title={Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics}, author={Scheidemann, Claus and Hemsel, Tobias and Friesen, Olga and Claes, Leander and Sextro, Walter}, year={2023} }
LibreCat
2023 | Conference Abstract | LibreCat-ID: 51118
@inproceedings{Scheidemann_Hemsel_Friesen_Claes_Sextro_2023, title={Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics}, author={Scheidemann, Claus and Hemsel, Tobias and Friesen, Olga and Claes, Leander and Sextro, Walter}, year={2023} }
LibreCat
2023 | Conference Abstract | LibreCat-ID: 51119
@inproceedings{Scheidemann_Hagedorn_Hemsel_Sextro_2023, title={Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process}, author={Scheidemann, Claus and Hagedorn, Oliver Ernst Caspar and Hemsel, Tobias and Sextro, Walter}, year={2023} }
LibreCat
2022 | Dissertation | LibreCat-ID: 34272 | 
@book{Schemmel_2022, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Enhanced process development by simulation of ultrasonic heavy wire bonding}, volume={13}, DOI={10.17619/UNIPB/1-1280}, publisher={Shaker}, author={Schemmel, Reinhard}, year={2022}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }
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2022 | Conference Paper | LibreCat-ID: 30371
@inproceedings{Hagedorn_Broll_Kirsch_Hemsel_Sextro_2022, place={Berlin}, title={Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding}, booktitle={CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems}, publisher={VDE VERLAG GMBH}, author={Hagedorn, Oliver Ernst Caspar and Broll, Marian and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter}, year={2022}, pages={138–143} }
LibreCat
2022 | Conference Paper | LibreCat-ID: 34104
@inproceedings{Scheidemann_Kirsch_Hemsel_Sextro_2022, title={Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding}, DOI={10.1109/estc55720.2022.9939478}, booktitle={2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)}, publisher={IEEE}, author={Scheidemann, Claus and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter}, year={2022} }
LibreCat
| DOI
2022 | Report | LibreCat-ID: 52045
@book{Scheidemann_Hemsel_Sextro_2022, title={Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen}, DOI={10.2314/KXP:1879655276}, publisher={LibreCat University}, author={Scheidemann, Claus and Hemsel, Tobias and Sextro, Walter}, year={2022} }
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2021 | Dissertation | LibreCat-ID: 34274
@book{Eichwald_2021, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Prozessgerechte Gestaltung von Werkzeugen auf Basis von Verschleißsimulationen am Beispiel des Ultraschallbondens}, volume={11}, publisher={Shaker}, author={Eichwald, Paul}, year={2021}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }
LibreCat
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2021 | Conference Paper | LibreCat-ID: 25265
@inproceedings{Dreiling_Itner_Feldmann_Scheidemann_Gravenkamp_Henning_2021, place={Wien}, title={Application and modelling of ultrasonic transducers using 1-3 piezoelectric composites with structured electrodes}, booktitle={Fortschritte der Akustik - DAGA 2021}, publisher={Deutsche Gesellschaft für Akustik e.V. (DEGA)}, author={Dreiling, Dmitrij and Itner, Dominik and Feldmann, Nadine and Scheidemann, Claus and Gravenkamp, Hauke and Henning, Bernd}, year={2021} }
LibreCat
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2021 | Journal Article | LibreCat-ID: 21436
@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={https://doi.org/10.1016/j.microrel.2021.114077}, journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }
LibreCat
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2020 | Conference Paper | LibreCat-ID: 17355
@inproceedings{Schemmel_Scheidemann_Hemsel_Kirsch_Sextro_2020, title={Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding}, booktitle={CIPS 2020; 11th International Conference on Integrated Power Electronics Systems}, author={Schemmel, Reinhard and Scheidemann, Claus and Hemsel, Tobias and Kirsch, Olaf and Sextro, Walter}, year={2020}, pages={1–6} }
LibreCat
2020 | Conference Paper | LibreCat-ID: 17706
@inproceedings{Schemmel_Krieger_Hemsel_Sextro_2020, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, DOI={10.1109/eurosime48426.2020.9152679}, booktitle={2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2020} }
LibreCat
| DOI
2019 | Conference Paper | LibreCat-ID: 15244
@inproceedings{Hagedorn_Pielsticker_Hemsel_Sextro_2019, title={Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen}, booktitle={2. VDI-Fachtagung Schwingungen 2019}, publisher={VDI Verlag GmbH · Düsseldorf 2019}, author={Hagedorn, Oliver Ernst Caspar and Pielsticker, Daniel and Hemsel, Tobias and Sextro, Walter}, year={2019} }
LibreCat
2019 | Conference Paper | LibreCat-ID: 15412
@inproceedings{Schemmel_Eacock_Dymel_Hemsel_Hunstig_Brökelmann_Sextro_2019, title={Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding}, DOI={10.4071/2380-4505-2019.1.000509}, booktitle={International Symposium on Microelectronics}, author={Schemmel, Reinhard and Eacock, Florian and Dymel, Collin and Hemsel, Tobias and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={509–514} }
LibreCat
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2019 | Journal Article | LibreCat-ID: 10334
@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding}, volume={295}, DOI={10.1016/j.sna.2019.04.025}, journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel, Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={653–662} }
LibreCat
| DOI
2018 | Conference Paper | LibreCat-ID: 9992
@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title={Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter}, year={2018}, pages={1–6} }
LibreCat
2018 | Conference Paper | LibreCat-ID: 9993
@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias}, year={2018}, pages={41–44} }
LibreCat