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39 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol. 15. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2023.
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2023 | Conference Abstract | LibreCat-ID: 47234
Sehlmeyer, Birte, Rebecca Kampmann, Claus Scheidemann, Tobias Hemsel, and Mathias Getzlaff. “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells.” In Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023.
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2023 | Conference Abstract | LibreCat-ID: 47235
Kampmann, Rebecca, Birte Sehlmeyer, Claus Scheidemann, Tobias Hemsel, and Mathias Getzlaff. “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells.” In Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023.
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2023 | Conference Abstract | LibreCat-ID: 51117
Scheidemann, Claus, Tobias Hemsel, Olga Friesen, Leander Claes, and Walter Sextro. “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” 2023.
LibreCat
2023 | Conference Abstract | LibreCat-ID: 51118
Scheidemann, Claus, Tobias Hemsel, Olga Friesen, Leander Claes, and Walter Sextro. “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” 2023.
LibreCat
2023 | Conference Abstract | LibreCat-ID: 51119
Scheidemann, Claus, Oliver Ernst Caspar Hagedorn, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” 2023.
LibreCat
2022 | Dissertation | LibreCat-ID: 34272 | 
Schemmel, Reinhard. Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding. Vol. 13. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2022. https://doi.org/10.17619/UNIPB/1-1280.
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2022 | Conference Paper | LibreCat-ID: 30371
Hagedorn, Oliver Ernst Caspar, Marian Broll, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of the Influence of Different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.” In CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, 138–43. Berlin: VDE VERLAG GMBH, 2022.
LibreCat
2022 | Conference Paper | LibreCat-ID: 34104
Scheidemann, Claus, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” In 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE, 2022. https://doi.org/10.1109/estc55720.2022.9939478.
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2022 | Report | LibreCat-ID: 52045
Scheidemann, Claus, Tobias Hemsel, and Walter Sextro. Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University, 2022. https://doi.org/10.2314/KXP:1879655276.
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2021 | Dissertation | LibreCat-ID: 34274
Eichwald, Paul. Prozessgerechte Gestaltung von Werkzeugen auf Basis von Verschleißsimulationen am Beispiel des Ultraschallbondens. Vol. 11. Schriften des Lehrstuhls für Dynamik und Mechatronik. Shaker, 2021.
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2021 | Conference Paper | LibreCat-ID: 25265
Dreiling, Dmitrij, Dominik Itner, Nadine Feldmann, Claus Scheidemann, Hauke Gravenkamp, and Bernd Henning. “Application and Modelling of Ultrasonic Transducers Using 1-3 Piezoelectric Composites with Structured Electrodes.” In Fortschritte Der Akustik - DAGA 2021. Wien: Deutsche Gesellschaft für Akustik e.V. (DEGA), 2021.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability 119 (2021): 114077. https://doi.org/10.1016/j.microrel.2021.114077.
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2020 | Conference Paper | LibreCat-ID: 17355
Schemmel, Reinhard, Claus Scheidemann, Tobias Hemsel, Olaf Kirsch, and Walter Sextro. “Experimental Analysis and Modelling of Bond Formation in Ultrasonic Heavy Wire Bonding.” In CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 1–6, 2020.
LibreCat
2020 | Conference Paper | LibreCat-ID: 17706
Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” In 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020. https://doi.org/10.1109/eurosime48426.2020.9152679.
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2019 | Conference Paper | LibreCat-ID: 15244
Hagedorn, Oliver Ernst Caspar, Daniel Pielsticker, Tobias Hemsel, and Walter Sextro. “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen.” In 2. VDI-Fachtagung Schwingungen 2019. VDI Verlag GmbH · Düsseldorf 2019, 2019.
LibreCat
2019 | Conference Paper | LibreCat-ID: 15412
Schemmel, Reinhard, Florian Eacock, Collin Dymel, Tobias Hemsel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Impact of Multi-Dimensional Vibration Trajectories on Quality and Failure Modes in Ultrasonic Bonding.” In International Symposium on Microelectronics, 509–14, 2019. https://doi.org/10.4071/2380-4505-2019.1.000509.
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2019 | Journal Article | LibreCat-ID: 10334
Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical 295 (2019): 653–62. https://doi.org/10.1016/j.sna.2019.04.025.
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2018 | Conference Paper | LibreCat-ID: 9992
Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 1–6, 2018.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9993
Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 41–44, 2018.
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